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The cumulative sales of semiconductor equipment in Japan hit a record high for the same period in history
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The cumulative sales of semiconductor equipment in Japan hit a record high for the same period in history

The cumulative sales of semiconductor equipment in Japan hit a record high for the same period in history

May 23, 2023

Statistics from the Semiconductor Manufacturing Equipment Association of Japan (SEAJ) show that in May 2022, sales of semiconductor manufacturing equipment in Japan were 15.232 billion yuan (307.718 billion yen). By May 2022, this figure has maintained a 17-month consecutive increase. From January to May 2022, the cumulative sales of Japanese semiconductor equipment reached 75.691 billion yuan.

LDI LASER FIBER

According to data from Yahoo Finance, as of June 24, shares of Japanese semiconductor maker Tokyo Weilitech rose 2.16%, Japanese semiconductor testing equipment supplier Advantest shares rose 1.12%, Japanese wafer cutting machines Shares in manufacturer Disco rose 4.29% and Japanese semiconductor and panel-making equipment maker Screen Holdings rose 1.81%.

As early as July 2021, the Semiconductor Manufacturing Equipment Association of Japan (SEAJ) released a semiconductor and flat panel display (FPD) manufacturing equipment market forecast report, which expects semiconductor manufacturing equipment sales to continue to grow over the next three years.

With current data, the report's predictions are correct. In May 2022, the cumulative sales of semiconductor equipment in Japan has exceeded 75.6 billion yuan, and this number is still growing.

The development of the Japanese semiconductor market may be positive, but Japan is currently facing a serious problem of brain drain in the semiconductor industry. Whether Japan can grasp this momentum is still unknown.


Hecho produces and supplies high-brightness programmable LED Light Source and Customized Optical Fiber bundles to flexibly meet the testing requirements of customers in the semiconductor industry. The products are widely used in AOI, LDI, high temperature testing, and wafer testing.

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