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  • What is laser direct imaging LDI
    Mar 18, 2022
    LDI, the full name is Laser Direct Imaging, is an exposure process used in the PCB process, and the image is directly imaged on the PCB by the laser scanning method, and the image is more refined. Advantages of LDI 1. Eliminate the negative film process in the exposure process, save the time and cost of loading and unloading the negative, and reduce the deviation caused by the expansion and contraction of the negative 2. Directly image the CAM data on the pcb, saving the CAM production process 3. The image resolution is high, and the fine wire can reach about 20um, which is suitable for the production of fine wire 4. Improved the yield rate of pcb production The largest market for laser direct imaging (LDI) consumption is the Asia-Pacific region, with a market share of more than 74% in 2019. It is followed by North America, which accounts for nearly 13% of the global market. For the major manufacturers of laser direct imaging systems (LDI), Orbotech, ORC Manufacturing, SCREEN, Via Mechanics, Manz, etc. occupy major market shares. Hecho Technology develops and manufactures LDI optical fiber, and can provide customers in the industry with customized solutions for 365nm and 405nm band optical fibers.
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  • Introduction to Laser Direct Imaging (LDI) Equipment Industry
    May 06, 2022
    Laser direct imaging refers to Laser Direct Imaging, abbreviated as LDI, which belongs to a type of direct imaging. The light is emitted by an ultraviolet laser and is mainly used for the exposure process in the PCB manufacturing process. The imaging quality of LDI technology is clearer than that of traditional exposure technology, and it has obvious advantages in mid-to-high-end PCB manufacturing. With the rapid progress of PCB design requirements, corresponding high-tech is required in the PCB production process (thinner materials, more complex structures, and finer graphics requirements within the range of micro-errors), traditional contact stencils Exposure and development technology can no longer meet the needs of such high-end PCB applications. This demand has led to changes in production technology, from contact stencil exposure and development to direct laser imaging. A software-controlled laser or laser source is used to laser image a photoresist-coated PCB, or to cure and image a solder mask at the end of the PCB process. Hecho specializes in the production of LDI optical fiber bundle, and can provide customized services for different branch numbers, lengths, and connectors according to customer needs. With strong R&D and production capabilities, it can flexibly meet the differentiated needs of different customers. Hecho also supply customized service for AOI Line light guides, and other Fiber Optic Bundles which for Optical Inspection equipment uses. LDI (Laser Direct Imaging) Industrial Chain Upstream Midstream Downstream Equipment Manufacturer Motion platform and components Orbotech HDI and Standard PCB Graphic generation module HAN'S LASER Thick copper and ceramic PCB The light path components CFMEE Super size PCB The exposure light source ORC Manufacturing Others Automatic control unit Limata Others Others
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