LDI Laser Imaging Fiber: Direct-Write Solution for Fine PCB Traces

In PCB manufacturing, conventional exposure processes require a photomask to transfer circuit patterns onto the board. Masks expand and contract with temperature and humidity, fine traces can misalign, and every product change requires a new mask — time-consuming and material-intensive.

LDI (Laser Direct Imaging) takes a different approach: no mask, direct laser scanning. CAM data drives the laser directly, "drawing" the circuit pattern onto the PCB‘s photosensitive layer. Finer imaging, no mask fabrication step, and no mask distortion errors.

In this system, optical fiber handles laser delivery and beam shaping.

What Makes LDI Fiber Different?

LDI lasers typically operate in the UV or near-UV range, placing high demands on fiber transmission efficiency and end-face quality. The fiber must deliver laser light from the source to the scanning head with low loss while maintaining beam uniformity. If fiber transmission is unstable, imaging accuracy suffers directly.

Hecho’s LDI laser imaging fiber is a coupling product developed specifically for this application. It has undergone technical validation and refinement within the LDI industry, delivering stable performance and supporting fine trace fabrication — suitable for PCB production with demanding precision requirements. Product page: https://www.gohecho.com/optical-fiber-bundles_c6

Beyond LDI fiber, Hecho‘s optical fiber bundle product line includes ring fiber, multi-branch bundles, and single-tube bundles — with customizable length, branch configuration, and connector specifications to match your optical path design.

If you have fiber selection requirements for LDI or PCB imaging systems, contact the Hecho technical team.