Let the light change life
other
Search
Home

Search

  • What is semiconductor lithography?
    May 16, 2022
    Fundamentals of Lithography Figure 1 shows a typical lithography process for defining shallow trench isolation features. This process includes the following steps: 1. Substrate Cleaning and Preparation 2. Form a thermal oxide layer and deposit a layer of silicon nitride on a clean substrate 3. Deposit a carbon hard mask followed by a layer of anti-reflection material 4. Deposit a layer of photoresist 5. Pre-baked photoresist 6. Align the substrate/resist and reticle and expose the photoresist using UV radiation and 4x-5x imaging. Repeat steps and scan 7. Post-exposure bake 8. Develop pattern in photoresist and hard bake to remove residual solvent 9. Perform an etch to open the Dielectric Anti-Reflection Coating (DARC) and hardmask patterns, and remove the photoresist and DARC 10. Perform an etch to open trenches in the substrate and remove the hardmask 11. Clean the surface Deep UV Lithography DUV technology for lithography is entirely based on projection optics, as the pattern on the photomask is much larger than the final pattern formed on the photoresist. The optical system in a 193 nm lithography tool is called a catadioptric system. The term means it uses lens (refractive) and reflective (reflection) elements to direct and condition the light from the laser Extreme UV Lithography EUV lithography is being developed to meet single-exposure patterning requirements for sub-22nm feature sizes (Figure 3). What makes this technology unique is the nature of the light source. See Extreme UV Lithography for more information. Hecho Fiber specializing in design and manufacture Fiber Optic Bundles and Fiber Optic Light Sources for over 18 years, the Fiber Products are widely used for Semiconductor filed, such as Laser Direct Imaging LDI Fiber Bundle, Fiber Optic Line Lights for AOI, and so on. OEM and ODM service is available to meet the differentiated needx of different customers.
    Read More
  • Global chip R&D spending in 2021
    Aug 05, 2022
    Market research firm IC Insights released an analysis of R&D trends in its latest 2022 McClean Report quarterly update, saying that about 56% of global semiconductor industry R&D spending in 2021 will come from companies headquartered in the Americas region, These companies are largely based in the United States, with a large percentage coming from Intel (19%). As shown in the chart below, semiconductor R&D spending by companies in the Asia-Pacific region (including foundries, fabless and IDM) will exceed 29% of the global total in 2021, followed by European companies with about 8% and Japan with nearly 7%. In 2011, chip suppliers in the Americas accounted for about 55 percent of global semiconductor R&D spending, compared with 18 percent in the Asia-Pacific region (including China). Nanjing Hecho Technology has strong optical fiber R&D and production capabilities, and can provide customized services for various Optical Fiber Bundles for different industries and usage needs to flexibly meet the differentiated needs of different customers. In addition, high-brightness LED Light Sources and Halogen Light Sources for use with optical fibers are available.
    Read More

Leave Message

Leave Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Submit

Home

Products

whatsApp

contact