Fundamentals of Lithography
Figure 1 shows a typical lithography process for defining shallow trench isolation features. This process includes the following steps:
1. Substrate Cleaning and Preparation
2. Form a thermal oxide layer and deposit a layer of silicon nitride on a clean substrate
3. Deposit a carbon hard mask followed by a layer of anti-reflection material
4. Deposit a layer of photoresist
5. Pre-baked photoresist
6. Align the substrate/resist and reticle and expose the photoresist using UV radiation and 4x-5x imaging. Repeat steps and scan
7. Post-exposure bake
8. Develop pattern in photoresist and hard bake to remove residual solvent
9. Perform an etch to open the Dielectric Anti-Reflection Coating (DARC) and hardmask patterns, and remove the photoresist and DARC
10. Perform an etch to open trenches in the substrate and remove the hardmask
11. Clean the surface
Deep UV Lithography
DUV technology for lithography is entirely based on projection optics, as the pattern on the photomask is much larger than the final pattern formed on the photoresist. The optical system in a 193 nm lithography tool is called a catadioptric system. The term means it uses lens (refractive) and reflective (reflection) elements to direct and condition the light from the laser
Extreme UV Lithography
EUV lithography is being developed to meet single-exposure patterning requirements for sub-22nm feature sizes (Figure 3). What makes this technology unique is the nature of the light source. See Extreme UV Lithography for more information.
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Market research firm IC Insights released an analysis of R&D trends in its latest 2022 McClean Report quarterly update, saying that about 56% of global semiconductor industry R&D spending in 2021 will come from companies headquartered in the Americas region, These companies are largely based in the United States, with a large percentage coming from Intel (19%).
As shown in the chart below, semiconductor R&D spending by companies in the Asia-Pacific region (including foundries, fabless and IDM) will exceed 29% of the global total in 2021, followed by European companies with about 8% and Japan with nearly 7%. In 2011, chip suppliers in the Americas accounted for about 55 percent of global semiconductor R&D spending, compared with 18 percent in the Asia-Pacific region (including China).
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