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+86 133 8200 9944
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Market research firm IC Insights released an analysis of R&D trends in its latest 2022 McClean Report quarterly update, saying that about 56% of global semiconductor industry R&D spending in 2...
With the gradual localization of upstream core optoelectronic components, the application cost of lasers will gradually decrease, and lasers will penetrate deeper into many industries. On the one hand...
China's laser industry is developing rapidly and has obvious competitive advantages. The proportion of the global laser market has also continued to increase. In 2020, the scale of China's laser marke...
Laser welding is a welding method that uses a high-energy-density laser beam as a heat source, that is, laser radiation heats the surface of the workpiece, and the surface heat diffuses into the inter...
Laser welding is a technology that uses the heat generated by a laser beam to melt plastic contact surfaces, thereby bonding thermoplastic sheets, films or molded parts together. Laser welding technol...
According to research by TrendForce, the shipment volume of smartphone camera modules in 2022 will be raised to 5.02 billion units, an annual increase of 5%. Since the price-performance ratio of the w...
Recently, there has been a lot of discussion about silicon wafers. Here we analyze it from several perspectives: First of all, in terms of demand, thanks to the rise of new applications such as 5G, ar...
Fundamentals of Lithography Figure 1 shows a typical lithography process for defining shallow trench isolation features. This process includes the following steps: 1. Substrate Cleaning and Preparatio...
According to the latest report from IC Insights, a well-known market research institution, the total installed capacity of global semiconductors will reach 263.6 million 8-inch equivalent wafers this ...
Laser direct imaging refers to Laser Direct Imaging, abbreviated as LDI, which belongs to a type of direct imaging. The light is emitted by an ultraviolet laser and is mainly used for the exposure pro...
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